The subtractive process starts with a metal
sheet that covers the entire MSAP substrates. The unwanted metal is
then carefully eliminated by chemical etching or mechanical machining to make
the desired circuit layout. This technique protects the necessary portions by
covering them with a photosensitive coating. However, subtractive manufacturing
is already an established method that is suitable for mainstream PCB
manufacturing. It may not be the best for high-density, small-scale, or
precision-required circuit boards.
Contact Info:-
High Quality PCB Co., Limited
Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China
Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China
Plant 2 address: Zhuhai, Guangdong, China
Plant 3 address: Dongguan, Guangdong, China
TEL: +86-755-23724206
WahtsApp: +86-189 2381 2997
Skype: shawnwang2006
Email: sales@efpcb.com
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