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Learn how an OEM
resolved complex design challenges using our Multi-functional
Solutions.
Due to the
reduction in electronics form factors and the need to include more and more
components into each device, many original equipment manufacturers (OEMs) are
looking to combine electromagnetic interference (EMI) and thermal solutions
into single assemblies. This adds to the complexity of the thermal design
process. It creates a need for multiple layers of thermal interface materials
whose performance interacts with each other.
Unit 4B
Caerphilly Business Park
Caerphilly CF83
3GS
Call Us on:
+44 (0)29 2125
2100
sales@techni3.com
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Ad Detail: Multi Functional Solutions - Techni3
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