Exploring Multi-functional Solutions - Techni3 - Neath Port Talbot

Learn how an OEM resolved complex design challenges using our Multi-functional Solutions.

Due to the reduction in electronics form factors and the need to include more and more components into each device, many original equipment manufacturers (OEMs) are looking to combine electromagnetic interference (EMI) and thermal solutions into single assemblies. This adds to the complexity of the thermal design process. It creates a need for multiple layers of thermal interface materials whose performance interacts with each other.