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Fan-out wafer metrology - Viewmm - Other

(Tempe, AZ, USA)

Post #: A45131113
Posted By: viewmm (viewmm ads)
Posted on: 28 February
Reply to: viewmm05@gmail.com
 

Viewmm develops innovative metrology solutions for advanced fan-out wafer-level packaging. Their technology enables non-destructive, high precision measurements of critical dimensions and film thicknesses for wafer-level packages. This allows manufacturers to improve yield and reduce costs through greater process control. Viewmm's unique approach combines advanced optics, proprietary algorithms, and big data analytics to provide rapid, accurate metrology that keeps pace with the latest fan-out trends like high density interconnects and chiplet integration


For More Info Visit : https://viewmm.com/en/fan-out-wafer-level-packaging/


#Fan-out wafer metrology #FAN-OUT WAFER-LEVEL PACKAGING


Address: 1711 W 17th St, Tempe, AZ 85281, United States

Hours: Closed â‹… Opens 8 a.m - 5 Pm ( Mon - Fri ) 

Phone: +1 480-295-3150

Email : sales@viewmm.com


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